Recently we have torn down the iPhone 8 model A1905 which contains a 2GB version of Apple’s own designed A11 Bionic SoC. More details regarding this SoC can be found here. Package marking is APL1W72 and die marking on the silicon is TMHS09.

On the right side you can download:

• Floorplan microscopy image frontside of the TMHS09 chip perfect for your article, blog or other media application. 4552×5903 pixel; 300 ppi resolution; 46 MB jpeg.
• Floorplan microscopy image backside of the TMHS09 chip. In case you want to have a microscopic view. 5737×7362 pixel; 300ppi resolution; 49MB jpeg.